The AI build-out is a stack of constraints — from megawatts to models. This interactive market map traces that stack across 11 layers and 24 segments: power generation, grid equipment and data-center cooling; semiconductors, memory and networking; and the cloud platforms, foundation models and applications on top.
It plots 520+ public and private companies against the segment each one supplies, the constraint it monetizes, and how durable that advantage looks — alongside the 14 live bottlenecks shaping the build-out today: grid power and interconnection queues, transformers and switchgear, liquid cooling, HBM and advanced packaging, leading-edge foundry capacity, cluster networking and optics, GPU allocation, and the data, security and robotics constraints further up the stack. Hover any ribbon in the flow for detail, and click a layer, segment or moat to filter the company tables. Figures are as of June 1, 2026.
